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Si8630/31/35
D OCUMENT C HANGE L IST
Revision 1.3 to Revision 1.4
Revision 0.1 to Revision 0.2
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Added Figure 3, “Common-Mode Transient
Immunity Test Circuit,” on page 8.
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Added chip graphics on page 1.
Moved Tables 1 and 11 to page 18.
Updated Table 6, “Insulation and Safety-Related
Specifications,” on page 15.
Updated Table 8, “IEC 60747-5-2 Insulation
Characteristics for Si86xxxx*,” on page 16.
Moved Table 12 to page 21.
Moved Table 13 to page 22.
Moved “Typical Performance Characteristics” to
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Added references to CQC throughout.
Added references to 2.5 kV RMS devices throughout.
Updated "5. Ordering Guide" on page 27.
Updated "10.1. Si863x Top Marking (16-Pin Wide
Body SOIC)" on page 34.
page 25.
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Updated "4. Pin Descriptions" on page 26.
Updated "5. Ordering Guide" on page 27.
Removed references to QSOP-16 package.
Revision 0.2 to Revision 1.0
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Reordered spec tables to conform to new
convention.
Removed “pending” throughout document.
Revision 1.0 to Revision 1.1
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Updated High Level Output Voltage VOH to 3.1 V in
Table 3, “Electrical Characteristics,” on page 9.
Updated High Level Output Voltage VOH to 2.3 V in
Table 4, “Electrical Characteristics,” on page 12.
Revision 1.1 to Revision 1.2
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Updated "5. Ordering Guide" on page 27 to include
MSL2A.
Revision 1.2 to Revision 1.3
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Updated Table 11 on page 18.
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junction temperature spec.
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Updated "3.3.1. Supply Bypass" on page 24.
Removed “3.3.2. Pin Connections” on page 23.
Updated "4. Pin Descriptions" on page 26.
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table notes.
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Updated "5. Ordering Guide" on page 27.
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Rev A devices.
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Updated "7. Land Pattern: 16-Pin Wide-Body SOIC"
on page 30.
Updated Top Marks.
36
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revision description.
Rev. 1.4
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